References

Dr. Samuel H. Liggero

Academic Director of MSEM and MSTML Programs at Tufts Gordon Institute

Letter of Recommendation

Ryan Sullivan

Engineering Manager

TransMedics

Letter of Recommendation

Timothy Cole

Senior Mechanical Engineer

DEKA Research & Development

Letter of Recommendation Graduate Program

Matthew White

Engineering Manager

DEKA Research & Development

Letter of Recommendation Graduate Program

Download Resume PDF

KEVIN KIM


kevinhoangkim@gmail.com | (603) 858-0389 | www.kevkimh.com | Burlington, MA

Mechanical engineer specializing in complex hardware design, system integration, and global manufacturing execution. Over seven years of experience leading mechanical development from concept through mass production across consumer, medical, and automation sectors. Proven ability to lead multidisciplinary teams across engineering and manufacturing sites through design validation, readiness, and risk mitigation to deliver reliable, high-volume hardware at scale. Success at driving design rigor, validation coverage, and supplier alignment for devices shipping in the millions worldwide.

Technical Skills: Design for Manufacturing • Thermal-Mechanical Architecture • GD&T & Tolerance Stack Analysis • Verification & Validation • Root-Cause & Corrective Action (RCCA) • Statistical Process Control (SPC, 6 Sigma, CpK) • Manufacturing Automation & Yield Optimization • Supplier Process Integration • BOM Cost Modeling & Value Engineering • PLM / ECO Configuration Management • SolidWorks • Creo • ANSYS

Professional Experience

TransMedics | Mechanical Engineer III

April 2024 - November 2024

  • Oversaw mechanical system architecture and reliability initiatives for a global hardware platform, driving long-term durability and manufacturability across thermal, fluidic, and structural subsystems.

  • Coordinated with international manufacturers and validation labs to synchronize subsystem qualification and compress iteration cycles.

  • Established robust frameworks for thermal, vibration, and environmental testing, increasing coverage and shortening verification time by approximately 30%.

  • Designed modular assembly fixtures that standardized builds and improved efficiency across production sites.

  • Authored change-control and release protocols implemented organization-wide, strengthening audit compliance and mechanical design traceability.

DEKA Research & Development | Mechanical Design Engineer

  • Invented and patented a centralized fluid-management architecture (US20210340486A1) utilizing an injection-molded disposable cassette sub-system that improved usability, reliability, and integration.

  • Served as mechanical systems lead for high-precision automated hardware platforms, owning thermal and fluidic subsystem design from prototype through production handoff.

  • Developed full-cycle validation test plans, partnering with controls, biology, and systems teams to secure first-time regulatory acceptance of prototype devices.

M.S. Engineering Management
Tufts University Gordon Institute

B.S. Mechanical Engineering
Tufts University

Education

June 2019 - March 2024

January 2024 - August 2025
Medford, MA

September 2015 - May 2019
Medford, MA

Amazon (Ring & Blink) | Product Design Engineer II

February 2025 - Present

  • Contributed to mechanical architecture and system readiness for Blink’s 2K and outdoor camera programs, integrating sealing, optics, and enclosure design for millions of units shipped worldwide.

  • Directed DFM/DFA reviews with global CMs (China, Taiwan, Vietnam) to streamline tooling and assembly, cutting defect rates 20% and stabilizing line yield across multi-site manufacturing operations.

  • Bridged product, hardware, and industrial design teams to balance requirements and accelerate production timelines.

  • Conducted structural and thermal analyses to verify rigidity and heat-path efficiency during early development.

  • Partnered with electrical and reliability engineers to refine PCB layout, antenna placement, and thermal interfaces.

  • Executed comprehensive mechanical reliability and validation test plans with cross-functional engineering teams, achieving >95% first-pass yield across IP65 ingress, drop, thermal, and environmental tests.

  • Championed cost-efficiency initiatives including resin consolidation, fastener reduction, and mold-flow optimization, resulting in roughly 10% BOM savings while aligning long-term sourcing strategies with operations and procurement.

  • Worked closely with Industrial Design and CMF teams to refine finishes and incorporate PCR-ABS materials supporting Amazon Devices sustainability goals.

  • Maintained complete design documentation, releases, and change control within Amazon’s PLM system.